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Setul de paduri termice ARCTIC TP-4 include 4 paduri cu dimensiuni de 120 x 20 x 1 mm, concepute pentru a asigura un transfer termic eficient intre componentele electronice si sistemele de racire. Cu o conductivitate termica ridicata, flexibilitate excelenta si izolare electrica, acestea sunt ideale pentru placi video, SSD-uri M.2, memorii, VRM-uri si alte componente care necesita o disipare eficienta a caldurii.
- Set cu 4 paduri termice: Include patru paduri pregatite pentru utilizare, ideale pentru instalari noi sau inlocuirea padurilor uzate.
- Dimensiuni de 120 x 20 mm: Format compact, potrivit pentru o gama variata de componente electronice.
- Grosime de 1 mm: Ofera un contact termic optim intre componente si radiator, compensand eficient spatiile dintre acestea.
- Conductivitate termica ridicata: Asigura disiparea rapida a caldurii pentru mentinerea unor temperaturi optime de functionare.
- Material flexibil: Se adapteaza usor la suprafetele componentelor pentru un transfer termic uniform.
- Izolare electrica: Materialul este neconductiv electric, oferind un plus de siguranta in timpul montajului si utilizarii.
- Compatibilitate extinsa: Potrivite pentru placi video, SSD-uri M.2, memorii, chipseturi, VRM-uri si alte componente electronice.
- Montaj simplu: Pot fi decupate cu usurinta la dimensiunea necesara pentru o instalare rapida si precisa.
- Fiabilitate ridicata: Materialele premium isi mentin proprietatile termice pe termen lung, asigurand performanta constanta si durabilitate.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Specifications
| General Specifications | |||
| Operating Ambient Temperature | -40-200 °C | Dimensions | 120 (L) x 20 (W) x 1 (H) mm |
| Thermal Pad Specifications | |||
| Hardness | 50 Shore OO | Dielectric Constant | 7.2 @1 MHz |
| Specific Gravity | 3.4 g/cm³ | Volume Resistance | 1.52 x 10^13 Ω-cm |
| Breakdown Voltage | 8620 V/mil | Flammability Rating | UL 94 V-0 |

