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Padul termic ARCTIC TP-4, cu dimensiuni de 100 x 100 x 1 mm, este conceput pentru a asigura un transfer termic eficient intre componentele electronice si sistemele de racire. Cu o conductivitate termica ridicata, flexibilitate excelenta si izolare electrica, acesta este ideal pentru imbunatatirea performantelor de racire ale PC-urilor, laptopurilor si altor echipamente electronice.
- Conductivitate termica ridicata: Asigura disiparea eficienta a caldurii si contribuie la mentinerea unor temperaturi optime de functionare.
- Dimensiuni generoase: Formatul de 100 x 100 mm permite decuparea usoara pentru utilizarea pe o gama larga de componente.
- Grosime de 1 mm: Potrivita pentru umplerea spatiilor dintre componente si radiator, oferind un contact termic optim.
- Material flexibil: Se adapteaza cu usurinta la suprafetele componentelor pentru un transfer eficient al caldurii.
- Izolare electrica: Materialul este neconductiv electric, oferind siguranta sporita in timpul instalarii si utilizarii.
- Compatibilitate extinsa: Recomandat pentru placi video, SSD-uri M.2, memorii, VRM-uri, chipseturi si alte componente electronice.
- Montaj simplu: Poate fi taiat cu usurinta la dimensiunea dorita pentru o instalare rapida si precisa.
- Fiabilitate ridicata: Materialele premium isi pastreaza proprietatile termice pe termen lung, asigurand performanta constanta.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Specifications
| General Specifications | |||
| Operating Ambient Temperature | -40-200 °C | Dimensions | 100 (L) x 100 (W) x 1 (H) mm |
| Thermal Pad Specifications | |||
| Hardness | 50 Shore OO | Dielectric Constant | 7.2 @1 MHz |
| Specific Gravity | 3.4 g/cm³ | Volume Resistance | 1.52 x 10^13 Ω-cm |
| Breakdown Voltage | 8620 V/mil | Flammability Rating | UL 94 V-0 |

