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Setul de paduri termice ARCTIC TP-4 include 4 paduri cu dimensiuni de 120 x 20 x 1,5 mm, concepute pentru a asigura un transfer termic eficient intre componentele electronice si sistemele de racire. Datorita conductivitatii termice ridicate, flexibilitatii excelente si izolarii electrice, acestea sunt ideale pentru placi video, SSD-uri M.2, memorii, VRM-uri si alte componente care necesita o disipare optima a caldurii.
- Set cu 4 paduri termice: Include patru paduri pregatite pentru utilizare, ideale pentru instalari noi sau inlocuirea padurilor termice uzate.
- Dimensiuni de 120 x 20 mm: Format practic, compatibil cu o gama variata de componente electronice.
- Grosime de 1,5 mm: Recomandata pentru aplicatii care necesita acoperirea unor spatii mai mari intre componenta si radiator.
- Conductivitate termica ridicata: Asigura transferul rapid al caldurii si contribuie la mentinerea unor temperaturi optime de functionare.
- Material flexibil: Se muleaza usor pe suprafetele componentelor pentru un contact termic eficient.
- Izolare electrica: Materialul neconductiv electric ofera siguranta sporita in timpul montajului si utilizarii.
- Compatibilitate extinsa: Potrivite pentru placi video, SSD-uri M.2, memorii, VRM-uri, chipseturi si alte componente electronice.
- Montaj simplu: Pot fi decupate cu usurinta la dimensiunea dorita pentru o instalare rapida si precisa.
- Durabilitate ridicata: Materialele premium isi pastreaza proprietatile termice pe termen lung, oferind performanta constanta si fiabilitate.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Specifications
| General Specifications | |||
| Operating Ambient Temperature | -40-200 °C | Dimensions | 120 (L) x 20 (W) x 1.5 (H) mm |
| Thermal Pad Specifications | |||
| Hardness | 50 Shore OO | Dielectric Constant | 7.2 @1 MHz |
| Specific Gravity | 3.4 g/cm³ | Volume Resistance | 1.52 x 10^13 Ω-cm |
| Breakdown Voltage | 8620 V/mil | Flammability Rating | UL 94 V-0 |

