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Padul termic ARCTIC TP-4, cu dimensiuni de 100 x 100 x 0,5 mm, este proiectat pentru a asigura un transfer eficient al caldurii intre componentele electronice si sistemele de racire. Cu o conductivitate termica ridicata, flexibilitate excelenta si izolare electrica, acesta reprezinta o solutie ideala pentru optimizarea temperaturilor in PC-uri, laptopuri si alte echipamente electronice.
- Conductivitate termica ridicata: Asigura un transfer eficient al caldurii pentru mentinerea unor temperaturi optime de functionare.
- Dimensiuni generoase: Formatul de 100 x 100 mm permite decuparea usoara la dimensiunea necesara pentru diferite componente.
- Grosime de 0,5 mm: Ideala pentru umplerea spatiilor mici dintre componente si radiator, asigurand un contact termic eficient.
- Material flexibil: Se adapteaza usor la suprafetele componentelor pentru o disipare optima a caldurii.
- Izolare electrica: Materialul este neconductiv electric, oferind un plus de siguranta in timpul utilizarii.
- Compatibilitate extinsa: Potrivit pentru placi video, SSD-uri M.2, module VRM, chipseturi, memorii si alte componente electronice.
- Montaj simplu: Poate fi decupat cu usurinta la dimensiunea dorita pentru o instalare rapida si precisa.
- Durabilitate ridicata: Isi mentine proprietatile termice pe termen lung, oferind performanta constanta si fiabilitate excelenta.
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Specifications
| General Specifications | |||
| Operating Ambient Temperature | -40-200 °C | Dimensions | 100 (L) x 100 (W) x 0.5 (H) mm |
| Thermal Pad Specifications | |||
| Hardness | 50 Shore OO | Dielectric Constant | 7.2 @1 MHz |
| Specific Gravity | 3.4 g/cm³ | Volume Resistance | 1.52 x 10^13 Ω-cm |
| Breakdown Voltage | 8620 V/mil | Flammability Rating | UL 94 V-0 |

