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Thermal Grizzly Hydronaut 30 g este o pasta termoconductoare de inalta performanta, conceputa pentru racirea eficienta a procesoarelor si placilor video. Ofera conductivitate termica excelenta, stabilitate pe termen lung si o cantitate generoasa, fiind ideala pentru utilizatori profesionisti, service-uri si sisteme de gaming sau statii de lucru.
- Cantitate 30 g: Ofera suficienta pasta pentru numeroase aplicari si utilizare profesionala.
- Conductivitate termica ridicata: Asigura un transfer eficient al caldurii pentru temperaturi optime si performanta constanta.
- Aplicare usoara: Consistenta optimizata permite distribuirea uniforma pe suprafata procesoarelor si placilor video.
- Stabilitate pe termen lung: Isi mentine proprietatile termice chiar si dupa utilizare intensa si indelungata.
- Neconductiva electric: Ofera siguranta sporita in utilizare, eliminand riscul de scurtcircuite.
- Compatibilitate extinsa: Potrivita pentru procesoare, placi video si alte componente care necesita racire performanta.
- Utilizare profesionala: Recomandata pentru service-uri, integratori de sisteme, gaming, overclocking moderat si statii de lucru.
Product information "Hydronaut Pro"
Hydronaut Pro is a silicone-free thermal paste with an optimized formulation that is suitable for use in both industrial systems and high-performance PC systems. Thanks to its outstanding thermal conductivity, it is particularly well suited for applications with large-surface heat sinks, such as gaming PCs with custom water cooling. Hydronaut Pro combines high performance with an attractive price-performance ratio and is also designed for overclocking applications.
Properties
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- Suitable for industrial applications
- Outstanding thermal conductivity
- Silicone-free
- Electrically non-conductive
- No hardening over time
- Available in three sizes: 2g | 6g | 30g
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Silicone-Free for Industrial Systems
Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, silicone-based oils (e.g., siloxanes) are used as the carrier fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect. In normal PC use, this is generally uncritical. In industrial applications, however, leaking silicone-based oil may be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties. The product is RoHS compliant and designed as an easy-to-apply thermal interface material for demanding users.
Silicone-free
Outstanding thermal conductivity
Electrically non-conductive
No hardening over time
Matching accessories
For optimal application, the TG Spatula Pro is included with Hydronaut Pro. The spatula's revised design allows for increased pressure during application, ensuring efficient spreading and a thinner layer of thermal paste.
Scope of Delivery
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- 1x Hydronaut Pro 30g
- 1x TG Spatula
- 1x TG Spatula Pro
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Specifications
| Color: | neon green | Electrical conductivity: | 0 pS/m |

