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Thermal Grizzly Hydronaut 2 g este o pasta termoconductoare de inalta performanta, conceputa pentru racirea eficienta a procesoarelor si placilor video. Ofera transfer termic excelent, aplicare usoara si stabilitate pe termen lung, fiind ideala pentru gaming, sisteme performante si overclocking moderat.
- Cantitate 2 g: Suficienta pentru una sau mai multe aplicari, in functie de dimensiunea componentelor.
- Conductivitate termica ridicata: Asigura un transfer eficient al caldurii pentru temperaturi mai scazute si performanta optima.
- Aplicare usoara: Consistenta optimizata permite distribuirea uniforma pe suprafata procesorului sau a placii video.
- Stabilitate pe termen lung: Isi mentine proprietatile termice chiar si dupa perioade indelungate de utilizare.
- Neconductiva electric: Ofera un plus de siguranta in timpul aplicarii si utilizarii.
- Compatibilitate extinsa: Potrivita pentru procesoare, placi video si alte componente care necesita o racire eficienta.
- Calitate Thermal Grizzly: Recomandata pentru utilizatorii care doresc performanta ridicata si fiabilitate in utilizarea zilnica.
Product information "Hydronaut Pro"
Hydronaut Pro is a silicone-free thermal paste with an optimized formulation that is suitable for use in both industrial systems and high-performance PC systems. Thanks to its outstanding thermal conductivity, it is particularly well suited for applications with large-surface heat sinks, such as gaming PCs with custom water cooling. Hydronaut Pro combines high performance with an attractive price-performance ratio and is also designed for overclocking applications.
Properties
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- Suitable for industrial applications
- Outstanding thermal conductivity
- Silicone-free
- Electrically non-conductive
- No hardening over time
- Available in three sizes: 2g | 6g | 30g
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Silicone-Free for Industrial Systems
Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, silicone-based oils (e.g., siloxanes) are used as the carrier fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect. In normal PC use, this is generally uncritical. In industrial applications, however, leaking silicone-based oil may be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties. The product is RoHS compliant and designed as an easy-to-apply thermal interface material for demanding users.
Silicone-free
Outstanding thermal conductivity
Electrically non-conductive
No hardening over time
Matching accessories
For optimal application, the TG Spatula Pro is included with Hydronaut Pro. The spatula's revised design allows for increased pressure during application, ensuring efficient spreading and a thinner layer of thermal paste.
Scope of Delivery
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- 1x Hydronaut Pro 2g
- 1x Applicator
- 1x TG Spatula
- 1x TG Spatula Pro
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Specifications
| Color: | neon green | Electrical conductivity: | 0 pS/m |

